High Density Interconnection In Hole
HDI Technology in Hole

High Density Interconnection






Blind & Burried 9+2+9 Laser Drill

Market Trend vs. Technology Solution

HDI Process Flow

Main Process of Build – up Layer

Construction Materials
Material Type
FR 4 Tetra Function ( Tg. 130 – 140 ℃ )
FR 4 High Tg ( Tg. 160 – 180 ℃ )
RCC ( Tg. 150 ℃ & Tg. 185 ℃ )
Ink ( VIL )
Comparison of Material
Prepreg | RCC | |
---|---|---|
Low Cost | ++ | – |
Strength | ++ | + |
Hole wall roughness | – | + |
Laminating control | + | – |
Dielectric thickness | 45um ~ | 30um ~ 80um |
Smear residue on target pad | – | ++ |
Dielectric constant | 3.9 ~ 4.7 | 3.2 ~ 3.8 |
Shelf time | ++ | + |
Working PNL size | ++ | + |
Comparison of Via Technologies
Mechanical Drilling | Laser Drilling | |
---|---|---|
Low Cost in Equipment | ++ | + |
Low Cost in Production | + | ++ |
Required Facilities | Drilling Machine | Laser Machine |
Consumable | Drill Bits, Backup Board | None |
Aspect Ratio | 9 | 1 |
Via Size Capacity | 200 um~ | 50~100um |
Speed | 140 H/min | 20,000 H/min |
Throughput | – | + |
Comparison of Blind Via
Prepreg

RCC

Build-up for 2 + N + 2
Through Hole
Inner Laser Via
Stack Hole
Inner Via Hole
Surface Laser Via

Laser Via Quality

1+6+1 without buried, extend to 1+N+1

1+4+4+1 with buried via, extend to 1+N+N+1

2+4+2 laser via on laser via

2+4+2 Staggered via, extend to 2+N+2

Blind via Capability

4- Layer Core Receiving

I.V.H.(Inner Via Hole) Drilling

Electroless Copper Plating

Electro Plating

Inner Via Hole Plugging
( for thickness >= 60 mil )

I.V.H.Grinding
( for thickness >= 60 mil )

Dry Film Lamination

D.F. Exposure / Developing

D.F. Strip

Black Oxide Treatment

Prepreg Layup

Lamination

Dry Film Lamination

D.F. Exposure / Developing

Etching

D.F. Strip

Mechanical Drlling for TH

Laser Drlling for Blind Via

Desmear / Electroless Copper Plating

Electro Plating

Dry film, Exposure & DES

Solder Mask Printing

S/M Exposure / Developing

Surface Finish

Symbol Mask Printing

Inspection
