High Density Interconnection In Hole
HDI Technology in Hole
High Density Interconnection
Blind & Burried 9+2+9 Laser Drill
Market Trend vs. Technology Solution
HDI Process Flow
Main Process of Build – up Layer
Construction Materials
Material Type
FR 4 Tetra Function ( Tg. 130 – 140 ℃ )- FR 4 High Tg ( Tg. 160 – 180 ℃ )
- RCC ( Tg. 150 ℃ & Tg. 185 ℃ )
- Ink ( VIL )
Comparison of Material
| Prepreg | RCC | |
|---|---|---|
| Low Cost | ++ | – |
| Strength | ++ | + |
| Hole wall roughness | – | + |
| Laminating control | + | – |
| Dielectric thickness | 45um ~ | 30um ~ 80um |
| Smear residue on target pad | – | ++ |
| Dielectric constant | 3.9 ~ 4.7 | 3.2 ~ 3.8 |
| Shelf time | ++ | + |
| Working PNL size | ++ | + |
Comparison of Via Technologies
| Mechanical Drilling | Laser Drilling | |
|---|---|---|
| Low Cost in Equipment | ++ | + |
| Low Cost in Production | + | ++ |
| Required Facilities | Drilling Machine | Laser Machine |
| Consumable | Drill Bits, Backup Board | None |
| Aspect Ratio | 9 | 1 |
| Via Size Capacity | 200 um~ | 50~100um |
| Speed | 140 H/min | 20,000 H/min |
| Throughput | – | + |
Comparison of Blind Via
Prepreg
RCC
Build-up for 2 + N + 2
Through Hole
Inner Laser Via
Stack Hole
Inner Via Hole
Surface Laser Via
Laser Via Quality
1+6+1 without buried, extend to 1+N+1
1+4+4+1 with buried via, extend to 1+N+N+1
2+4+2 laser via on laser via
2+4+2 Staggered via, extend to 2+N+2
Blind via Capability
4- Layer Core Receiving
I.V.H.(Inner Via Hole) Drilling
Electroless Copper Plating
Electro Plating
Inner Via Hole Plugging
( for thickness >= 60 mil )
I.V.H.Grinding
( for thickness >= 60 mil )
Dry Film Lamination
D.F. Exposure / Developing
D.F. Strip
Black Oxide Treatment
Prepreg Layup
Lamination
Dry Film Lamination
D.F. Exposure / Developing
Etching
D.F. Strip
Mechanical Drlling for TH
Laser Drlling for Blind Via
Desmear / Electroless Copper Plating
Electro Plating
Dry film, Exposure & DES
Solder Mask Printing
S/M Exposure / Developing
Surface Finish
Symbol Mask Printing
Inspection
